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M386A4G40DM1-CRC00

M386A4G40DM1-CRC00

M386A4G40DM1-CRC00

Samsung Electronics

M386A4G40DM1-CRC00 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M386A4G40DM1-CRC00 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
ECCN (US) 4A994.a
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 36
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 2Gx4
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks Quad
Number of Chip Banks 16
CAS Latency 15
Supplier Package LRDIMM
Mounting Socket
PCB changed 288
Lead Shape Ball
Part Status Obsolete
Pin Count 288
Organization 4Gx72
Module Type 288RDIMM
RoHS Status RoHS Compliant

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