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TSM-114-03-F-DV-A-P-TR

TSM-114-03-F-DV-A-P-TR

TSM-114-03-F-DV-A-P-TR

Samtec Inc.

TSM Series 2-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Gold Liquid Crystal Polymer (LCP) 28-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

TSM-114-03-F-DV-A-P-TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Contact Plating Gold
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series TSM
Feature Board Guide, Pick and Place
Part Status Active
Termination Solder
Connector Type Header
Number of Positions 28
Number of Rows 2
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Shrouding Unshrouded
Number of Contacts 28
Contact Finish - Post Tin
Contact Length - Mating 0.420 10.67mm
Contact Finish Thickness - Mating 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
125 $3.00000 $375
TSM-114-03-F-DV-A-P-TR Product Details

TSM-114-03-F-DV-A-P-TR Overview


A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tape & Reel (TR) case.It is part of the TSM Series of products.A number of features make it more powerful because of its Board Guide, Pick and Place feature.There is no operating temperature for the device.

TSM-114-03-F-DV-A-P-TR Features


TSM series


TSM-114-03-F-DV-A-P-TR Applications


There are a lot of Samtec Inc.
TSM-114-03-F-DV-A-P-TR Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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