SI32286-A-GM Overview

The 56-VFQFN Exposed Pad package reduces the amount of space on a board.A Tube-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 2 circuits.When the voltage for 3.3V is provided, improved efficiency can be achieved.-40°C~85°C is the operating temperature that can be set for reliable performance.Telecom ICs are of type DIGITAL SLIC.There are many similarities between it and the electronic parts of the ProSLIC? series.

SI32286-A-GM Features

Available in the 56-VFQFN Exposed Pad package
DIGITAL SLIC as telecom IC type

SI32286-A-GM Applications

There are a lot of Silicon Labs SI32286-A-GM Telecom applications.

• M13 MUX
• Channel Service Units (CSUs): T1/E1/J1
• T1/E1/J1 add/drop multiplexers (MUX)
• ISDN Primary Rate Interfaces (PRA)
• DSLAMs
• CSU/DSU E1/T1/J1 Interface
• Fiber In The Loop (FITL)
• Multiplexers
• Digital Cross-Connect Systems
• E1 Network Equipment