STB13N60M2 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website
SOT-23
STB13N60M2 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
26 Weeks
Lifecycle Status
ACTIVE (Last Updated: 8 months ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Cut Tape (CT)
Series
MDmesh™ II Plus
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Resistance
380mOhm
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Base Part Number
STB13N
JESD-30 Code
R-PSSO-G2
Number of Elements
1
Power Dissipation-Max
110W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
110W
Case Connection
DRAIN
Turn On Delay Time
11 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
380m Ω @ 5.5A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
580pF @ 100V
Current - Continuous Drain (Id) @ 25°C
11A Tc
Gate Charge (Qg) (Max) @ Vgs
17nC @ 10V
Rise Time
10ns
Drain to Source Voltage (Vdss)
600V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±25V
Fall Time (Typ)
9.5 ns
Turn-Off Delay Time
41 ns
Continuous Drain Current (ID)
11A
Gate to Source Voltage (Vgs)
25V
Drain to Source Breakdown Voltage
650V
Pulsed Drain Current-Max (IDM)
44A
Avalanche Energy Rating (Eas)
125 mJ
Height
4.6mm
Length
10.4mm
Width
9.35mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
STB13N60M2 Product Details
STB13N60M2 Description
The MDmeshTM M2 technology was used to build the STB13N60M2 N-channel Power MOSFETs. These devices have low on-resistance and optimal switching characteristics due to their strip layout and improved vertical structure, making them suited for the most demanding high-efficiency converters.