STN1NF10 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website
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STN1NF10 Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-261-4, TO-261AA
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Series
STripFET™ II
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
4
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
FET General Purpose Power
Voltage - Rated DC
100V
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Current Rating
1A
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
STN1N
Pin Count
4
JESD-30 Code
R-PDSO-G4
Number of Elements
1
Power Dissipation-Max
2.5W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2.5W
Case Connection
DRAIN
Turn On Delay Time
4 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
800m Ω @ 500mA, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
105pF @ 25V
Current - Continuous Drain (Id) @ 25°C
1A Tc
Gate Charge (Qg) (Max) @ Vgs
6nC @ 10V
Rise Time
5.5ns
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
6.5 ns
Turn-Off Delay Time
13 ns
Continuous Drain Current (ID)
500mA
Threshold Voltage
3V
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
1A
Drain-source On Resistance-Max
0.8Ohm
Drain to Source Breakdown Voltage
100V
Height
1.6mm
Length
6.7mm
Width
3.7mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.76000
$0.76
500
$0.7524
$376.2
1000
$0.7448
$744.8
1500
$0.7372
$1105.8
2000
$0.7296
$1459.2
2500
$0.722
$1805
STN1NF10 Product Details
STN1NF10 Description
The latest improvement of STMicroelectroni's distinctive "Single Feature SizeTM"strip-based technology is this Power MOSFET. The resultant transistor has remarkable manufacturing reproducibility thanks to its tough avalanche characteristics, exceptionally high packing density for low on-resistance, and fewer key alignment steps.