TE0803-02-04EV-1E3 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-02-04EV-1E3 Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU4EV-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-02-04EV-1E3 Product Details
TE0803-02-04EV-1E3 Overview
A MPU Core module or board is used in the microcontroller.Processors with Zynq UltraScale+ XCZU4EV-1SFVC784E cores drive it.It is default for the microcontroller to set the mode to 0°C~85°C.128MB is the size of the flash on the MCU electronics.In this case, the connector type is B2B.TE0803-Series.To ensure that the software runs normally, the RAM size is reduced to 2GB.
TE0803-02-04EV-1E3 Features
Core processor of Zynq UltraScale+ XCZU4EV-1SFVC784E Flash size of 128MB
TE0803-02-04EV-1E3 Applications
There are a lot of Trenz Electronic GmbH TE0803-02-04EV-1E3 Microcontroller, Microprocessor, FPGA Modules applications.