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TE0803-02-04EV-1E3

TE0803-02-04EV-1E3

TE0803-02-04EV-1E3

Trenz Electronic GmbH

TE0803-02-04EV-1E3 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-02-04EV-1E3 Datasheet

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Specifications
Name Value
Type Parameter
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU4EV-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
TE0803-02-04EV-1E3 Product Details

TE0803-02-04EV-1E3 Overview


A MPU Core module or board is used in the microcontroller.Processors with Zynq UltraScale+ XCZU4EV-1SFVC784E cores drive it.It is default for the microcontroller to set the mode to 0°C~85°C.128MB is the size of the flash on the MCU electronics.In this case, the connector type is B2B.TE0803-Series.To ensure that the software runs normally, the RAM size is reduced to 2GB.

TE0803-02-04EV-1E3 Features


Core processor of Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash size of 128MB

TE0803-02-04EV-1E3 Applications


There are a lot of Trenz Electronic GmbH TE0803-02-04EV-1E3 Microcontroller, Microprocessor, FPGA Modules applications.

  • Patient Monitoring
  • Data Acquisition
  • IoT Secure Gateways
  • Medical Instrumentation
  • Closed Loop Motor Control
  • Portable Data Terminals
  • Human Machine Control Panel
  • Process Monitoring
  • Embedded User Interfaces
  • Embedded Control Processing

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