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XAZU3EG-L1SFVC784I

XAZU3EG-L1SFVC784I

XAZU3EG-L1SFVC784I

Xilinx Inc.

784 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.72V

SOT-23

XAZU3EG-L1SFVC784I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.8MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Length 23mm
Height Seated (Max) 3.32mm
Width 23mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $622.70000 $622.7
XAZU3EG-L1SFVC784I Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 1.8MB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MPU, FPGA technique.Zynq® UltraScale+™ MPSoC EG is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 128 I/Os in total.A power supply with a 0.72V voltage rating should be utilized when using this system on chip SoC.As a result, there are 784 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU3EG-L1SFVC784I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare

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