Through Hole 2Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S200A
SOT-23
XC17S200APDG8I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Surface Mount
NO
Number of Pins
8
Operating Temperature
-40°C~85°C
Packaging
Tube
Published
1999
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
250
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
2.54mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
XC17S200A
Pin Count
8
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
OTP
Memory Size
2Mb
Supply Current-Max
0.015mA
Output Characteristics
3-STATE
Memory Width
1
Standby Current-Max
0.001A
Parallel/Serial
SERIAL
I/O Type
COMMON
Memory IC Type
CONFIGURATION MEMORY
Height Seated (Max)
4.5974mm
Length
9.3599mm
Width
7.62mm
Radiation Hardening
No
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$7.024400
$7.0244
10
$6.626792
$66.26792
100
$6.251691
$625.1691
500
$5.897822
$2948.911
1000
$5.563983
$5563.983
XC17S200APDG8I Product Details
XC17S200APDG8I Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Tube external packaging.A qualified individual who has the ability to operate within -40°C~85°C.OTP allows for programmability.The voltage fed to it is 3V~3.6V.There is a memory device mounted in Through Hole position for this device.FPGA is limFPGAed to 2Mb bytes for the size of the data storage.To find other similar parts, search for "XC17S200A".There is a requirement that it is supplied with a voltage of 3.3V.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.The temperature should be kept below 250 in reflow soldering.FPGA is equipped wFPGAh 8 pins.SERIAL-process memory transmits data.For the memory chip to operate, it requires a voltage not exceeding 0.015mA.With the part are included 8 pins.Memory is configured as COMMON for memory's I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.
XC17S200APDG8I Features
Operating temperature: -40°C~85°C. OTP program capability. CONFIGURATION MEMORY memory IC. SERIAL processing. COMMON I/O equipped.
XC17S200APDG8I Applications
There are a lot of Xilinx Inc. XC17S200APDG8I applications of configuration proms for FPGAs.