XC17S50APDG8C Overview

This package makes use of the 8-DIP (0.300, 7.62mm) programming language.Packaging for the external environment.In the state of 0°C~70°C, licensed to work.FPGA is programmable through OTP.The voltage is 3V~3.6V.This memory device is mounted in Through Hole.500kb is the maximum storage size.Look for "XC17S50A" for other related parts.In order for it to function, it requires a voltage supply of 3.3V.Various functions can be applied to 8 terminations.In order to use this memory device, a maximum voltage of 3.6V should be used.3V is the minimum voltage required to supply the device.This is a CONFIGURATION MEMORY memory chip.The reflow soldering process should be done at a temperature no higher than 250.Pins on it are 8-shaped.Through SERIAL-processing, data is transmitted from this memory to the CPU.A memory chip can operate at a voltage no greater than 0.015mA.Parts come with 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.

XC17S50APDG8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S50APDG8C Applications

There are a lot of Xilinx Inc. XC17S50APDG8C applications of configuration proms for FPGAs.

• data buffer
• main computer memory
• mainframes
• workstations,
• supercomputers
• embedded logic
• personal digital assistants
• cell phones
• networks
• DVD disk buffer