485 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 150 I/O 1V
SOT-23
XC7Z012S-1CLG485I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Package / Case
484-LFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Zynq®-7000
Published
2016
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
485
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B485
Supply Voltage-Max (Vsup)
1.05V
Supply Voltage-Min (Vsup)
0.95V
Number of I/O
150
Speed
667MHz
RAM Size
256KB
Core Processor
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Clock Frequency
667MHz
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Artix™-7 FPGA, 55K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Length
19mm
Height Seated (Max)
1.6mm
Width
19mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$113.54000
$113.54
XC7Z012S-1CLG485I Product Details
XC7Z012S-1CLG485I Description
XC7Z012S-1CLG485I developed by Xilinx Inc. is a type of SoC. It has two notable features: one is the large scale of hardware, which is usually based on the IP design model; the other is the large proportion of software, which requires software and hardware co-design. The XC7Z012S-1CLG485ISoC has obvious advantages in performance, cost, power consumption, reliability, life cycle and scope of application, so it is an inevitable trend in the development of integrated circuit design. In the field of terminal chips that are sensitive to performance and power consumption, SoC has already occupied a dominant position; and its application is expanding to a wider field. A single chip to realize a complete electronic system is the future development direction of the IC industry.