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XC7Z035-2FFG900E

XC7Z035-2FFG900E

XC7Z035-2FFG900E

Xilinx Inc.

900 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

SOT-23

XC7Z035-2FFG900E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 100 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 2
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800
Length 31mm
Height Seated (Max) 3.35mm
Width 31mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,891.50000 $1
XC7Z035-2FFG900E Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 275K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In total, there are 900 terminations, which is great for system on a chip.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This power supply is rated with a maximum voltage of 1.05V.Power is supplied to it at least in the amount of 950mV.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z035-2FFG900E System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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