FPGAs Kintex? UltraScale+? Series 1156-BBGA, FCBGA
SOT-23
XCKU11P-L2FFVA1156E Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1156-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2012
Series
Kintex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
464
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
653100
Total RAM Bits
53964800
Number of LABs/CLBs
37320
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU11P-L2FFVA1156E Product Details
XCKU11P-L2FFVA1156E Overview
As part of the 1156-BBGA, FCBGA package, it is included. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 464 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 653100 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 0.698V~0.876V , at which it runs. FPGAs belonging to the Kintex? UltraScale+? series are a type of FPGA that belong to the Kintex? UltraScale+? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. It is for space saving reasons that this FPGA model is contained in Tray. A device like this one offers 53964800 RAM bits, which is a considerable amount of memory. This FPGA is built as an array of 37320 LABs/CLBs.
XCKU11P-L2FFVA1156E Features
464 I/Os Up to 53964800 RAM bits
XCKU11P-L2FFVA1156E Applications
There are a lot of Xilinx Inc. XCKU11P-L2FFVA1156E FPGAs applications.