XCKU15P-3FFVE1760E Overview

There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 1143450 logic elements or cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. The supply voltage of the device is 0.873V~0.927V , at which it runs. As part of the Kintex? UltraScale+? series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that are offered by this fpga chips are 82329600. 65340 LABs/CLBs are integrated into this FPGA.

XCKU15P-3FFVE1760E Features

668 I/Os
Up to 82329600 RAM bits

XCKU15P-3FFVE1760E Applications

There are a lot of Xilinx Inc. XCKU15P-3FFVE1760E FPGAs applications.

• Automotive
• Industrial IoT
• Scientific Instruments
• Embedded Vision
• Medical Electronics
• Server Applications
• Software-defined radio
• Automotive Applications
• Data Mining
• Ecosystem