FPGAs Virtex? UltraScale+? Series 1924-BBGA, FCBGA
SOT-23
XCVU11P-L2FLGF1924E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1924-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
624
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2835000
Total RAM Bits
396150400
Number of LABs/CLBs
162000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU11P-L2FLGF1924E Product Details
XCVU11P-L2FLGF1924E Overview
A 1924-BBGA, FCBGA package is provided with this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Fpga chips is programmed wFpga chipsh 624 I/Os for transferring data in a more coherent manner. A fundamental building block contains 2835000 logic elements or cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 0.698V~0.876V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. There is an FPGA model contained in Tray in order to conserve space. The RAM bits that are offered by this fpga chips are 396150400. 162000 LABs/CLBs are integrated into this FPGA.
XCVU11P-L2FLGF1924E Features
624 I/Os Up to 396150400 RAM bits
XCVU11P-L2FLGF1924E Applications
There are a lot of Xilinx Inc. XCVU11P-L2FLGF1924E FPGAs applications.