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XCVU11P-L2FLGF1924E

XCVU11P-L2FLGF1924E

XCVU11P-L2FLGF1924E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 1924-BBGA, FCBGA

SOT-23

XCVU11P-L2FLGF1924E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 1924-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 624
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2835000
Total RAM Bits 396150400
Number of LABs/CLBs 162000
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU11P-L2FLGF1924E Product Details

XCVU11P-L2FLGF1924E Overview


A 1924-BBGA, FCBGA package is provided with this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Fpga chips is programmed wFpga chipsh 624 I/Os for transferring data in a more coherent manner. A fundamental building block contains 2835000 logic elements or cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 0.698V~0.876V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. There is an FPGA model contained in Tray in order to conserve space. The RAM bits that are offered by this fpga chips are 396150400. 162000 LABs/CLBs are integrated into this FPGA.

XCVU11P-L2FLGF1924E Features


624 I/Os
Up to 396150400 RAM bits

XCVU11P-L2FLGF1924E Applications


There are a lot of Xilinx Inc. XCVU11P-L2FLGF1924E FPGAs applications.

  • Radar and Sensors
  • Security systems
  • Video & Image Processing
  • Computer hardware emulation
  • Space Applications
  • High Performance Computing
  • Enterprise networking
  • Automotive
  • ADAS
  • Data Mining

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