XCVU13P-1FIGD2104I Overview

There is a 2104-BBGA, FCBGA package that includes this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Fpga chips is programmed wFpga chipsh 676 I/Os for transferring data in a more coherent manner. There are 3780000 logic elements/cells to form a fundamental building block. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. There are many types of FPGAs in the Virtex? UltraScale+? series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The RAM bits that this device offer is 514867200. The FPGA consists of 216000 LABs/CLBs.

XCVU13P-1FIGD2104I Features

676 I/Os
Up to 514867200 RAM bits

XCVU13P-1FIGD2104I Applications

There are a lot of Xilinx Inc. XCVU13P-1FIGD2104I FPGAs applications.

• OpenCL
• Integrating multiple SPLDs
• Video & Image Processing
• Medical imaging
• Defense Applications
• Security systems
• Cryptography
• Space Applications
• Broadcast
• ASIC prototyping