XCVU13P-2FHGA2104E Overview

As part of the 2104-BBGA, FCBGA package, it is included. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Having 832 I/Os makes data transfers more coherent. A fundamental building block consists of 3780000 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. FPGAs belonging to the Virtex? UltraScale+? series are a type of FPGA that belong to the Virtex? UltraScale+? series of FPGAs. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. In order to save space, this FPGA model has been contained in Tray. There are 514867200 RAM bits that are available with this device. This FPGA module has a RAM si11.8MBe of 11.8MB that is sufficient to make sure that the program is able to run normally. This FPGA is built as an array of 216000 LABs/CLBs.

XCVU13P-2FHGA2104E Features

832 I/Os
Up to 514867200 RAM bits

XCVU13P-2FHGA2104E Applications

There are a lot of Xilinx Inc. XCVU13P-2FHGA2104E FPGAs applications.

• Aerospace and Defense
• Device controllers
• Automation
• Data Center
• ADAS
• Camera time adjustments
• Industrial Ethernet
• Software-defined radio
• ASIC prototyping
• Military DSP