0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 668 I/O
SOT-23
XCZU19EG-3FFVE1924E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
1924-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC EG
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
668
Speed
600MHz, 667MHz, 1.5GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$9,539.88000
$9
XCZU19EG-3FFVE1924E Product Details
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1924-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 668 I/Os.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM. Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU19EG-3FFVE1924E System On Chip (SoC) applications.