784 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 252 I/O 0.85V
SOT-23
XCZU2CG-2SFVC784I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC CG
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
784
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B784
Number of I/O
252
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$373.10000
$373.1
XCZU2CG-2SFVC784I Product Details
This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 784-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 252 inputs and outputs.Ideally, a power supply with a voltage of 0.85V should be used.system on a chip benefits from 784 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT
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