900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.72V
SOT-23
XCZU5CG-L2FBVB900E Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC CG
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.72V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B900
Supply Voltage-Max (Vsup)
0.742V
Supply Voltage-Min (Vsup)
0.698V
Number of I/O
204
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$2,542.41000
$2
XCZU5CG-L2FBVB900E Product Details
This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.In total, there are 900 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
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XCZU5CG-L2FBVB900E System On Chip (SoC) applications.