AUIRF7759L2TR Descriptions

The AUIRF7759L2TR(1) combines the latest Automotive HEXFET? Power MOSFET Silicon technology with innovative DirectFET? packaging to deliver the lowest on-state resistance in a DPak (TO-252AA)-sized package with a 0.7 mm profile. When application note AN-1035 addressing manufacturing methods and processes is followed, the DirectFET? package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques. In automotive power systems, the DirectFET? packaging enables dual-sided cooling to enhance thermal transfer.

AUIRF7759L2TR  Features

• Advanced Process Technology

• Optimized for Automotive Motor Drive, DC-DC, and other Heavy Load Applications

• Exceptionally Small Footprint and Low Profile

• High Power Density

• Low Parasitic Parameters

• Dual Sided Cooling

• 175°C Operating Temperature

• Repetitive Avalanche Capability for Robustness and Reliability

• Lead-free, RoHS and Halogen-free

• Automotive Qualified

AUIRF7759L2TR Applications

• Power Management

• Consumer Electronics

• Portable Devices

• Industrial