AUIRFR5410 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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AUIRFR5410 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2006
Series
HEXFET®
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Additional Feature
AVALANCHE RATED, HIGH RELIABILITY
Subcategory
Other Transistors
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PSSO-G2
Number of Elements
1
Power Dissipation-Max
66W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
66W
Case Connection
DRAIN
Turn On Delay Time
15 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
205m Ω @ 7.8A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
760pF @ 25V
Current - Continuous Drain (Id) @ 25°C
13A Tc
Gate Charge (Qg) (Max) @ Vgs
58nC @ 10V
Rise Time
58ns
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
46 ns
Turn-Off Delay Time
45 ns
Continuous Drain Current (ID)
13A
Threshold Voltage
-2V
JEDEC-95 Code
TO-252AA
Gate to Source Voltage (Vgs)
20V
Drain-source On Resistance-Max
0.205Ohm
Drain to Source Breakdown Voltage
-100V
Pulsed Drain Current-Max (IDM)
52A
Height
2.39mm
Length
6.73mm
Width
6.22mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.86000
$1.86
75
$1.49880
$112.41
150
$1.34887
$202.3305
525
$1.04912
$550.788
AUIRFR5410 Product Details
AUIRFR5410 Description
AUIRFR5410 is a type of HEXFET? power MOSFET developed by Infineon Technologies for low on-resistance per silicon area. It is designed utilizing the latest processing techniques. High flexibility and reliability can be ensured based on its fast switching speed, ruggedized device design, and a 175??C junction operating temperature. All these features enable this device to be well suited for automotive and other applications.