FF1800R17IP5PBPSA1 Description

The FF1800R17IP5PBPSA1 is a PrimePACK?3+B-series module with Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and pre-applied Thermal Interface Material. Insulated-gate bipolar transistor, or IGBT, is a type of power semiconductor die. The physical construction and packaging of multiple IGBT power semiconductor dies into a single package is known as an IGBT power module. Normal electrical connections between the dies include half-bridge, 3-level, dual, chopper, booster, etc.

FF1800R17IP5PBPSA1 Features

Electrical Features

• Low switching losses

• Low VCEsat

• Tvjop=175°C

• Extended operating temperature Tvjop

• High current density

Mechanical Features

• Package with CTI>400

• Pre-applied Thermal Interface Material

• High creepage and clearance distances

• High power and thermal cycling capability

• High power density

FF1800R17IP5PBPSA1 Applications

• Traction drives

• Wind turbines

• High power converters

• Motor drives