FP30R06W1E3B11BOMA1 Description

FP30R06W1E3B11BOMA1 IGBT module is a modular semiconductor product which is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply and other equipment. IGBT modules have the characteristics of energy saving, convenient installation and maintenance, and stable heat dissipation. IGBT module is the core device for energy conversion and transmission, commonly known as the "CPU" of power electronic devices. As a national strategic emerging industry, it is widely used in rail transit, smart grid, aerospace, electric vehicles and new energy equipment.

FP30R06W1E3B11BOMA1 Features

Low switching losses

Low VCEsat

Trench IGBT 3

VCEsat with positive temperature coefficient

FP30R06W1E3B11BOMA1 Applications

Motor drives

Air conditioning

Auxiliary inverters