FZ2400R12HE4B9HOSA2 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website
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FZ2400R12HE4B9HOSA2 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
50 Weeks
Mounting Type
Chassis Mount
Package / Case
Module
Surface Mount
NO
Transistor Element Material
SILICON
Operating Temperature
-40°C~150°C
Published
2002
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
9
ECCN Code
EAR99
Additional Feature
UL APPROVED
Terminal Position
UPPER
Terminal Form
UNSPECIFIED
JESD-30 Code
R-PUFM-X9
Number of Elements
3
Configuration
Single Switch
Case Connection
ISOLATED
Power - Max
13500W
Transistor Application
POWER CONTROL
Halogen Free
Not Halogen Free
Polarity/Channel Type
N-CHANNEL
Input
Standard
Current - Collector Cutoff (Max)
5mA
Voltage - Collector Emitter Breakdown (Max)
1200V
Current - Collector (Ic) (Max)
3560A
Turn On Time
880 ns
Vce(on) (Max) @ Vge, Ic
2.1V @ 15V, 2400A
Turn Off Time-Nom (toff)
1320 ns
IGBT Type
Trench Field Stop
NTC Thermistor
No
Input Capacitance (Cies) @ Vce
150nF @ 25V
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1,041.880601
$1
10
$1,007.621471
$10
25
$1,000.617151
$25
50
$993.661520
$49683.076
100
$973.223820
$97322.382
500
$903.643287
$451821.6435
FZ2400R12HE4B9HOSA2 Product Details
FZ2400R12HE4B9HOSA2 Description
The FZ2400R12HE4B9HOSA2 is an IHM-B module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode. Insulated-gate bipolar transistor, or IGBT, is a type of power semiconductor die. The physical construction and packaging of multiple IGBT power semiconductor die into a single package is known as an IGBT power module.