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IRF3315S

IRF3315S

IRF3315S

Infineon Technologies

IRF3315S datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRF3315S Datasheet

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Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Surface Mount YES
Transistor Element Material SILICON
Operating Temperature -55°C~175°C TJ
Packaging Tube
Published 1997
Series HEXFET®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature AVALANCHE RATED
HTS Code 8541.29.00.95
Technology MOSFET (Metal Oxide)
Terminal Position SINGLE
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PSSO-G2
Qualification Status Not Qualified
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 3.8W Ta 94W Tc
Operating Mode ENHANCEMENT MODE
Case Connection DRAIN
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 82m Ω @ 12A, 10V
Vgs(th) (Max) @ Id 4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1300pF @ 25V
Current - Continuous Drain (Id) @ 25°C 21A Tc
Gate Charge (Qg) (Max) @ Vgs 95nC @ 10V
Drain to Source Voltage (Vdss) 150V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
Drain Current-Max (Abs) (ID) 21A
Drain-source On Resistance-Max 0.082Ohm
Pulsed Drain Current-Max (IDM) 84A
DS Breakdown Voltage-Min 150V
Avalanche Energy Rating (Eas) 350 mJ
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
250 $2.08180 $520.45
IRF3315S Product Details

IRF3315S Description

Fifth  Generation  HEXFETs from  International  Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon  area. This benefit,  combined with the fast  switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with a highly efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to  HEX-4.  It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. TheD2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF3315L) is available for low-profile applications.



IRF3315S Features 

Advanced Process Technology

Surface Mount (IRF3315S)

Low-profile through-hole (IRF3315L)

175??C Operating Temperature

Fast Switching

Fully Avalanche Rated



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