IRF6614 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRF6614 Datasheet
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric ST
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2006
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
3
ECCN Code
EAR99
Technology
MOSFET (Metal Oxide)
Terminal Position
BOTTOM
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-XBCC-N3
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
2.1W Ta 42W Tc
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
8.3m Ω @ 12.7A, 10V
Vgs(th) (Max) @ Id
2.25V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
2560pF @ 20V
Current - Continuous Drain (Id) @ 25°C
12.7A Ta 55A Tc
Gate Charge (Qg) (Max) @ Vgs
29nC @ 4.5V
Drain to Source Voltage (Vdss)
40V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±20V
Drain Current-Max (Abs) (ID)
12.7A
Drain-source On Resistance-Max
0.0083Ohm
Pulsed Drain Current-Max (IDM)
102A
DS Breakdown Voltage-Min
40V
Avalanche Energy Rating (Eas)
22 mJ
RoHS Status
Non-RoHS Compliant
IRF6614 Product Details
IRF6614 Description
IRF6614 is a type of DirectFET? power MOSFET developed by Infineon Technologies utilizing its latest Silicon technology and the advanced DirectFET? packaging to provide extremely low on-state resistance in a package with a MICRO-8 footprint. It is able to minimize both conduction and switching losses based on its low resistance, low charge, and ultra-low package inductance. As a result, power MOSFET IRF6614 is ideally suitable for high-efficiency DC-DC converters.