IRF7306TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
SOT-23
IRF7306TRPBF Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1997
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
100mOhm
Additional Feature
ULTRA LOW RESISTANCE
Voltage - Rated DC
-30V
Max Power Dissipation
2W
Terminal Form
GULL WING
Current Rating
-3.6A
Base Part Number
IRF7306PBF
Number of Elements
2
Row Spacing
6.3 mm
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
11 ns
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
100m Ω @ 1.8A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
440pF @ 25V
Current - Continuous Drain (Id) @ 25°C
3.6A
Gate Charge (Qg) (Max) @ Vgs
25nC @ 10V
Rise Time
17ns
Drain to Source Voltage (Vdss)
30V
Fall Time (Typ)
18 ns
Turn-Off Delay Time
25 ns
Continuous Drain Current (ID)
-3.6A
Threshold Voltage
-1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
-30V
Pulsed Drain Current-Max (IDM)
14A
FET Technology
METAL-OXIDE SEMICONDUCTOR
Recovery Time
80 ns
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
-1 V
Height
1.75mm
Length
4.9784mm
Width
4.05mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.06000
$1.06
500
$1.0494
$524.7
1000
$1.0388
$1038.8
1500
$1.0282
$1542.3
2000
$1.0176
$2035.2
2500
$1.007
$2517.5
IRF7306TRPBF Product Details
IRF7306TRPBF Description
The fifth generation HEXFET of the International Rectifier Company adopts advanced processing technology to achieve the lowest possible switch. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications.
The SO-8 has been modified through a custom lead frame to enhance its thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications. Multiple devices can be used in one application, greatly reducing the circuit board space. The package is designed for the vapor phase. Infrared wave soldering technology. In typical printed circuit board installation applications, it is possible to consume more than 0.8W.
IRF7306TRPBF Features
GenerationVTechnology
Ultra Low On-Resistance
Dual P-Channel Mosfet
Surface Mount
Available in Tape &Reel
Dynamic dv/dt Rating
Fast Switching
Lead-Free
IRF7306TRPBF Applications
HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications.