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IRF7342D2PBF

IRF7342D2PBF

IRF7342D2PBF

Infineon Technologies

IRF7342D2PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRF7342D2PBF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Operating Temperature -55°C~150°C TJ
Packaging Tube
Published 2004
Series FETKY™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
Resistance 105MOhm
Subcategory Other Transistors
Voltage - Rated DC -55V
Technology MOSFET (Metal Oxide)
Current Rating -3.4A
Number of Elements 1
Configuration Single
Power Dissipation-Max 2W Ta
Power Dissipation 2W
Turn On Delay Time 14 ns
FET Type P-Channel
Rds On (Max) @ Id, Vgs 105m Ω @ 3.4A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 690pF @ 25V
Current - Continuous Drain (Id) @ 25°C 3.4A Ta
Gate Charge (Qg) (Max) @ Vgs 38nC @ 10V
Rise Time 10ns
Drain to Source Voltage (Vdss) 55V
Drive Voltage (Max Rds On,Min Rds On) 4.5V 10V
Vgs (Max) ±20V
Fall Time (Typ) 22 ns
Turn-Off Delay Time 43 ns
Continuous Drain Current (ID) -3.4A
Threshold Voltage -1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage -55V
Dual Supply Voltage -55V
FET Feature Schottky Diode (Isolated)
Nominal Vgs -1 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.841046 $0.841046
10 $0.793440 $7.9344
100 $0.748528 $74.8528
500 $0.706159 $353.0795
1000 $0.666188 $666.188
IRF7342D2PBF Product Details

IRF7342D2PBF Description

IRF7342D2PBF is a 55V Dual P-Channel HEXFET Power MOSFET in a SO-8 package. IRF7342D2PBF achieves extraordinarily low on-resistance per silicon area by utilizing cutting-edge production techniques. This feature offers the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.

IRF7342D2PBF is appropriate in a range of power applications since the SO-8 has been upgraded through a unique lead frame for improved thermal properties and multiple-die capability. These upgrades allow for the usage of many devices while drastically reducing board space in an application. The IRF7342D2PBF package is made for infrared, vapor phase, or wave soldering processes. In a typical PCB mount application, it is possible to dissipate more power than 0.8W.


IRF7342D2PBF Features

  • Capable of being wave-soldered

  • Planar cell structure for wide SOA

  • Optimized for broadest availability from distribution partners

  • Product qualification according to JEDEC standard

  • Silicon optimized for applications switching below <100KHz

  • Industry-standard surface-mount power package

  • RoHS Compliant

  • Low RDS(on)

  • Dynamic dv/dt Rating

  • Fast Switching

  • Dual P-Channel MOSFET


IRF7342D2PBF Applications

  • High Current

  • Motor Control

  • Audio Amplifiers

  • High-Speed Switching 

  • Uninterruptible Power Supply (UPS)

  • Industrial Actuators


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