IRF7342D2PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRF7342D2PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2004
Series
FETKY™
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
SMD/SMT
ECCN Code
EAR99
Resistance
105MOhm
Subcategory
Other Transistors
Voltage - Rated DC
-55V
Technology
MOSFET (Metal Oxide)
Current Rating
-3.4A
Number of Elements
1
Configuration
Single
Power Dissipation-Max
2W Ta
Power Dissipation
2W
Turn On Delay Time
14 ns
FET Type
P-Channel
Rds On (Max) @ Id, Vgs
105m Ω @ 3.4A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
690pF @ 25V
Current - Continuous Drain (Id) @ 25°C
3.4A Ta
Gate Charge (Qg) (Max) @ Vgs
38nC @ 10V
Rise Time
10ns
Drain to Source Voltage (Vdss)
55V
Drive Voltage (Max Rds On,Min Rds On)
4.5V 10V
Vgs (Max)
±20V
Fall Time (Typ)
22 ns
Turn-Off Delay Time
43 ns
Continuous Drain Current (ID)
-3.4A
Threshold Voltage
-1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
-55V
Dual Supply Voltage
-55V
FET Feature
Schottky Diode (Isolated)
Nominal Vgs
-1 V
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.841046
$0.841046
10
$0.793440
$7.9344
100
$0.748528
$74.8528
500
$0.706159
$353.0795
1000
$0.666188
$666.188
IRF7342D2PBF Product Details
IRF7342D2PBF Description
IRF7342D2PBF is a 55V Dual P-Channel HEXFET Power MOSFET in a SO-8 package. IRF7342D2PBF achieves extraordinarily low on-resistance per silicon area by utilizing cutting-edge production techniques. This feature offers the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
IRF7342D2PBF is appropriate in a range of power applications since the SO-8 has been upgraded through a unique lead frame for improved thermal properties and multiple-die capability. These upgrades allow for the usage of many devices while drastically reducing board space in an application. The IRF7342D2PBF package is made for infrared, vapor phase, or wave soldering processes. In a typical PCB mount application, it is possible to dissipate more power than 0.8W.
IRF7342D2PBF Features
Capable of being wave-soldered
Planar cell structure for wide SOA
Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100KHz