IRFH5025TR2PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRFH5025TR2PBF Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerVDFN
Number of Pins
8
Supplier Device Package
8-PQFN (5x6)
Packaging
Cut Tape (CT)
Published
2013
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Max Operating Temperature
150°C
Min Operating Temperature
-55°C
Max Power Dissipation
3.6W
Technology
MOSFET (Metal Oxide)
Number of Elements
1
Element Configuration
Single
Power Dissipation
3.6W
Turn On Delay Time
9 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
100mOhm @ 5.7A, 10V
Vgs(th) (Max) @ Id
5V @ 150μA
Input Capacitance (Ciss) (Max) @ Vds
2150pF @ 50V
Current - Continuous Drain (Id) @ 25°C
3.8A Ta
Gate Charge (Qg) (Max) @ Vgs
56nC @ 10V
Rise Time
6.3ns
Drain to Source Voltage (Vdss)
250V
Fall Time (Typ)
6.1 ns
Turn-Off Delay Time
17 ns
Continuous Drain Current (ID)
32A
Threshold Voltage
20V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
250V
Input Capacitance
2.15nF
Recovery Time
83 ns
Drain to Source Resistance
100mOhm
Rds On Max
100 mΩ
Nominal Vgs
20 V
Height
838.2μm
Length
5.9944mm
Width
5mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
IRFH5025TR2PBF Product Details
IRFH5025TR2PBF Description
IRFH5025TR2PBF emerges as a member of HEXFET? power MOSFETs provided by Infineon Technologies. It is compatible with existing surface mount techniques, thus it can be manufactured in an easier way. Low thermal resistance to PCB (<0.8 ??C/W) enables better thermal dissipation. Low conduction losses can also be realized due to its low RDS (on). As a result, IRFH5025TR2PBF is well suited for inverters in DC motors, secondary side synchronous rectification, boost converters, and DC-DC brick applications.