IRFR120NTRPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRFR120NTRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Number of Pins
3
Supplier Device Package
D-Pak
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Published
1998
Series
HEXFET®
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
SMD/SMT
Resistance
210mOhm
Max Operating Temperature
175°C
Min Operating Temperature
-55°C
Voltage - Rated DC
100V
Technology
MOSFET (Metal Oxide)
Current Rating
9.1A
Number of Elements
1
Number of Channels
1
Power Dissipation-Max
48W Tc
Element Configuration
Single
Power Dissipation
39W
Turn On Delay Time
4.5 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
210mOhm @ 5.6A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
330pF @ 25V
Current - Continuous Drain (Id) @ 25°C
9.4A Tc
Gate Charge (Qg) (Max) @ Vgs
25nC @ 10V
Rise Time
23ns
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
23 ns
Turn-Off Delay Time
32 ns
Continuous Drain Current (ID)
9.4A
Threshold Voltage
4V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
100V
Dual Supply Voltage
100V
Input Capacitance
330pF
Recovery Time
150 ns
Max Junction Temperature (Tj)
175°C
Drain to Source Resistance
210mOhm
Rds On Max
210 mΩ
Nominal Vgs
4 V
Height
2.52mm
Length
6.7056mm
Width
6.22mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.93000
$0.93
500
$0.9207
$460.35
1000
$0.9114
$911.4
1500
$0.9021
$1353.15
2000
$0.8928
$1785.6
2500
$0.8835
$2208.75
IRFR120NTRPBF Product Details
IRFR120NTRPBF Description
IRFR120NTRPBF is a member of the fifth-generation HEXFETs that are manufactured by Infineon Technologies based on advanced processing techniques. Based on these techniques, it is able to provide extremely low on-resistance per silicon area, fast switching speed, and ruggedized device design. As a result, it is extremely efficient and reliable for electronic designers to use in a broad range of applications.