IRFU9120NPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRFU9120NPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
TO-251-3 Short Leads, IPak, TO-251AA
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tube
Published
1998
Series
HEXFET®
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
ECCN Code
EAR99
Resistance
480MOhm
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Additional Feature
AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE
Subcategory
Other Transistors
Voltage - Rated DC
-100V
Technology
MOSFET (Metal Oxide)
Peak Reflow Temperature (Cel)
260
Current Rating
-6.6A
[email protected] Reflow Temperature-Max (s)
30
Number of Elements
1
Power Dissipation-Max
40W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
39W
Case Connection
DRAIN
Turn On Delay Time
14 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
480m Ω @ 3.9A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
350pF @ 25V
Current - Continuous Drain (Id) @ 25°C
6.6A Tc
Gate Charge (Qg) (Max) @ Vgs
27nC @ 10V
Rise Time
47ns
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
Fall Time (Typ)
31 ns
Turn-Off Delay Time
28 ns
Continuous Drain Current (ID)
-6.6A
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
6.5A
Drain to Source Breakdown Voltage
-100V
Pulsed Drain Current-Max (IDM)
26A
Dual Supply Voltage
-100V
Nominal Vgs
-4 V
Height
6.22mm
Length
6.7056mm
Width
2.3876mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
IRFU9120NPBF Product Details
IRFU9120NPBF Description
IRFU9120NPBF is a -100v HEXFET? Power MOSFET. The HEXFET IRFU9120NPBF from International Rectifier utilizes advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.