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IRG4CC30UB

IRG4CC30UB

IRG4CC30UB

Infineon Technologies

IRG4CC30UB datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRG4CC30UB Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case Die
Surface Mount YES
Transistor Element Material SILICON
JESD-609 Code e0
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature ULTRA FAST SPEED
Subcategory Insulated Gate BIP Transistors
Terminal Position UPPER
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code O-XUUC-N
Qualification Status Not Qualified
Number of Elements 1
Configuration SINGLE
Input Type Standard
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Voltage - Collector Emitter Breakdown (Max) 600V
Vce(on) (Max) @ Vge, Ic 2.2V @ 15V, 6A
Gate-Emitter Thr Voltage-Max 6V
RoHS Status ROHS3 Compliant
IRG4CC30UB Product Details

IRG4CC30UB Description


IRG4CC30UB is a 600v IGBT Die in wafer form. An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily used as an electronic switch, which, as it was developed, came to combine high efficiency and fast switching. It consists of four alternating layers (P–N–P–N) that are controlled by a metal–oxide–semiconductor (MOS) gate structure. 



IRG4CC30UB Features


Collector-to- Emitter Saturation Voltage: 2.2V

Colletor-to-Emitter Breakdown Voltage: 600V

Gate Threshold Voltage: 3.0~6.0V

Zero Gate Voltage Collector Current: 250μA

Gate-to-Emitter Leakage Current: ±1.1μA



IRG4CC30UB Applications


Automotive 

Infotainment & cluster 

Communications equipment 

Wireless infrastructure 

Personal electronics 

Connected peripherals & printers


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