IRG4PF50WPBF datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available on our website
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IRG4PF50WPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
TO-247-3
Number of Pins
3
Weight
38.000013g
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2004
Part Status
Last Time Buy
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Termination
Through Hole
ECCN Code
EAR99
Additional Feature
LOW CONDUCTION LOSS
Subcategory
Insulated Gate BIP Transistors
Voltage - Rated DC
600V
Max Power Dissipation
200W
Terminal Position
SINGLE
Current Rating
51A
Number of Elements
1
Element Configuration
Dual
Power Dissipation
200W
Case Connection
COLLECTOR
Input Type
Standard
Turn On Delay Time
29 ns
Transistor Application
POWER CONTROL
Rise Time
26ns
Polarity/Channel Type
N-CHANNEL
Turn-Off Delay Time
110 ns
Collector Emitter Voltage (VCEO)
2.7V
Max Collector Current
51A
JEDEC-95 Code
TO-247AC
Collector Emitter Breakdown Voltage
900V
Collector Emitter Saturation Voltage
2.25V
Turn On Time
54 ns
Test Condition
720V, 28A, 5 Ω, 15V
Vce(on) (Max) @ Vge, Ic
2.7V @ 15V, 28A
Turn Off Time-Nom (toff)
370 ns
Gate Charge
160nC
Current - Collector Pulsed (Icm)
204A
Td (on/off) @ 25°C
29ns/110ns
Switching Energy
190μJ (on), 1.06mJ (off)
Gate-Emitter Voltage-Max
20V
Gate-Emitter Thr Voltage-Max
6V
Fall Time-Max (tf)
220ns
Height
20.3mm
Length
15.875mm
Width
5.3mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$6.79000
$6.79
25
$5.84800
$146.2
100
$5.07770
$507.77
500
$4.42160
$2210.8
1,000
$3.85106
$3.85106
IRG4PF50WPBF Product Details
IRG4PF50WPBF Description
IRG4PF50WPBF belongs to the family of IGBTs that are manufactured by Infineon Technologies to minimize switching losses and conduction losses. It is optimized for use in welding and switch-mode power supply applications. It is able to deliver lower conduction and switching losses, tighter parameter distribution, and exceptional reliability. Minimal minority-carrier recombination and low on-state losses are used to achieve maximum flexibility in device application.