AVALANCHE RATED, HIGH RELIABILITY, LOGIC LEVEL COMPATIBLE, ULTRA-LOW RESISTANCE
Subcategory
FET General Purpose Power
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
JESD-30 Code
R-PSSO-G2
Number of Elements
1
Power Dissipation-Max
57W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
57W
Case Connection
DRAIN
Turn On Delay Time
8 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
37m Ω @ 15A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
710pF @ 25V
Current - Continuous Drain (Id) @ 25°C
25A Tc
Gate Charge (Qg) (Max) @ Vgs
20nC @ 5V
Rise Time
57ns
Drive Voltage (Max Rds On,Min Rds On)
5V 10V
Vgs (Max)
±16V
Fall Time (Typ)
37 ns
Turn-Off Delay Time
25 ns
Continuous Drain Current (ID)
25A
JEDEC-95 Code
TO-252AA
Gate to Source Voltage (Vgs)
16V
Drain to Source Breakdown Voltage
55V
Pulsed Drain Current-Max (IDM)
100A
Avalanche Energy Rating (Eas)
61 mJ
Height
2.3876mm
Length
6.7056mm
Width
6.22mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.36000
$1.36
500
$1.3464
$673.2
1000
$1.3328
$1332.8
1500
$1.3192
$1978.8
2000
$1.3056
$2611.2
2500
$1.292
$3230
IRLR3105TRPBF Product Details
IRLR3105TRPBF Description
This HEXFET? Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175??C junction operating temperature, fast switching speed, and improved repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in a wide variety of applications. The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRLU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.