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LCMXO3D-9400HC-6SG72I

LCMXO3D-9400HC-6SG72I

LCMXO3D-9400HC-6SG72I

Lattice Semiconductor Corporation

FPGAs MachXO3D Series 72-QFN

SOT-23

LCMXO3D-9400HC-6SG72I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 72-QFN
Operating Temperature -40°C~100°C TJ
Series MachXO3D
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~3.465V
Reach Compliance Code compliant
Number of I/O 58
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 9400
Total RAM Bits 442368
Number of LABs/CLBs 1175
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $31.65000 $31.65
500 $31.3335 $15666.75
1000 $31.017 $31017
1500 $30.7005 $46050.75
2000 $30.384 $60768
2500 $30.0675 $75168.75
LCMXO3D-9400HC-6SG72I Product Details

LCMXO3D-9400HC-6SG72I Overview


This package is included in the 72-QFN package and is available for purchase. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Its 58 I/Os help it transfer data more efficiently. The basic building blocks of logic contain 9400 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 2.375V~3.465V and uses a battery to supply power. FPGAs belonging to the MachXO3D series are a type of FPGA that belong to the MachXO3D series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 442368 bFpga chipss. 1175 LABs and CLBs are built into this FPGA.

LCMXO3D-9400HC-6SG72I Features


58 I/Os
Up to 442368 RAM bits

LCMXO3D-9400HC-6SG72I Applications


There are a lot of Lattice Semiconductor Corporation LCMXO3D-9400HC-6SG72I FPGAs applications.

  • Enterprise networking
  • ASIC prototyping
  • Radar and Sensors
  • Camera time adjustments
  • Automation
  • Consumer Electronics
  • Distributed Monetary Systems
  • Device controllers
  • Telecommunication
  • Defense Applications

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