DN2625DK6-G datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Microchip Technology stock available on our website
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DN2625DK6-G Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-VDFN Exposed Pad
Weight
37.393021mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tray
Published
2013
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
8
ECCN Code
EAR99
Resistance
3.5Ohm
Terminal Finish
MATTE TIN
Additional Feature
LOW THRESHOLD
Subcategory
FET General Purpose Power
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
40
JESD-30 Code
R-PDSO-N8
Qualification Status
Not Qualified
Number of Elements
1
Number of Channels
2
Voltage
250V
Element Configuration
Dual
Current
11A
Case Connection
DRAIN
Turn On Delay Time
10 ns
FET Type
2 N-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
3.5 Ω @ 1A, 0V
Input Capacitance (Ciss) (Max) @ Vds
1000pF @ 25V
Gate Charge (Qg) (Max) @ Vgs
7.04nC @ 1.5V
Rise Time
20ns
Fall Time (Typ)
20 ns
Turn-Off Delay Time
10 ns
Continuous Drain Current (ID)
1.1A
Gate to Source Voltage (Vgs)
20V
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Depletion Mode
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$2.56000
$2.56
25
$2.13200
$53.3
100
$1.96110
$196.11
DN2625DK6-G Product Details
DN2625DK6-G Description
The DN2625DK6-G is a low-threshold Depletion-mode (normally-on) transistor that utilizes an advanced vertical DMOS structure and a well-proven silicon gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors as well as the high input impedance and positive temperature coefficient inherent in Metal-Oxide Semiconductor (MOS) devices. Characteristic of all MOS structures, this DN2625DK6-G is free from thermal runaway and thermally induced secondary breakdown.