VSC8662XIC-03

join

new-10%

Manufacturer part number:VSC8662XIC-03

Manufacturer:Microchip Technology

Description:256 TerminationsTelecom device1 Circuits

Case Package:SOT-23

Datasheet:VSC8662XIC-03 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	9 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type	Surface Mount
Package / Case	256-BGA
Surface Mount	YES
Packaging	Tray
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	256
Max Operating Temperature	100°C
Min Operating Temperature	-40°C
Terminal Position	BOTTOM
Terminal Form	BALL
Supply Voltage	1.2V
JESD-30 Code	S-PBGA-B256
Function	Ethernet
Temperature Grade	INDUSTRIAL
Number of Circuits	1
Data Rate	1.25 Gbps
Number of Transceivers	2
Height Seated (Max)	2mm
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$21.47000	$21.47
10	$19.85500	$198.55
25	$18.24560	$456.14
100	$16.95750	$1695.75

VSC8662XIC-03 Overview

A 256-BGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.The telecom IC is composed of 1 circuits.Telecom switching configuration has 256 terminations.It operates at a voltage of 1.2V.A minimum temperature value -40°C is set to ensure normal operation.A maximum value of 100°C is set to ensure normal operation.Transceivers 2 are integrated into telecommunication tools.