A3PE1500-FG676 Overview

This package is included in the 676-BGA package and is available for purchase. Fpga chips is programmed wFpga chipsh 444 I/Os for transferring data in a more coherent manner. By attaching the Surface Mount connector, you can use this FPGA module with your development board. The supply voltage of the device is 1.425V~1.575V , at which it runs. It is a type of FPGA belonging to the ProASIC3E seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are 276480 RAM bits that are available with this device. Parts related to this part can be found using its base part number A3PE1500. This FPGA module has a RAM si33.8kBe of 33.8kB that is sufficient to make sure that the program is able to run normally. In order to make it work, 676 pins have been designed. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. This module is capable of operating at a maximum temperature of 70°C. The operating temperature should be higher than 0°C. There are 1500000 gates in its basic building block. To store and transfer data, there are 38400 registers that are used. The maximum supply voltage it supports is 1.575V. Fpga semiconductor is able to work wfpga semiconductorh the minimal supply voltage of 1.425V. There is a possibility that this FPGA will be able to reach a speed of 231MHz. There is a device package provided by 676-FBGA (27x27), which is the supplier.

A3PE1500-FG676 Features

444 I/Os
Up to 276480 RAM bits
676 LABs/CLBs
70°C gates
38400 registers

A3PE1500-FG676 Applications

There are a lot of Microsemi Corporation A3PE1500-FG676 FPGAs applications.

• Video & Image Processing
• Distributed Monetary Systems
• Medical ultrasounds
• Medical Applications
• Data center hardware accelerators
• Secure Communication
• Aerospace and Defense
• Integrating multiple SPLDs
• Space Applications
• Development Boards and Shields for Microcontrollers