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FDC6327C

FDC6327C

FDC6327C

ON Semiconductor

FDC6327C datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDC6327C Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Number of Pins 6
Weight 36mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2000
Series PowerTrench®
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
Termination SMD/SMT
ECCN Code EAR99
Resistance 80MOhm
Terminal Finish TIN (SN)
Subcategory Other Transistors
Max Power Dissipation 960mW
Terminal Form GULL WING
Current Rating 2.7A
Number of Elements 2
Number of Channels 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 960mW
Power - Max 700mW
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 80m Ω @ 2.7A, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 325pF @ 10V
Current - Continuous Drain (Id) @ 25°C 2.7A 1.9A
Gate Charge (Qg) (Max) @ Vgs 4.5nC @ 4.5V
Rise Time 14ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time 14 ns
Continuous Drain Current (ID) 1.9A
Threshold Voltage 900mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage 20V
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Logic Level Gate
Nominal Vgs 900 mV
Height 1.1mm
Length 3mm
Width 1.7mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.20494 $0.61482
6,000 $0.19172 $1.15032
15,000 $0.17850 $2.6775
30,000 $0.16924 $5.0772
FDC6327C Product Details

FDC6327C           Description


  These Nipp channel 2.5V MOSFET are manufactured using an advanced PowerTritch process tailored to minimize on-resistance while maintaining low gate charge for excellent switching performance. These devices are designed to provide excellent power consumption in a very small footprint and are suitable for impractical applications in larger and more expensive SO-8 and TSSOP-8 packages.

 

FDC6327C          Features

 

N-Channel

?2.7A, 20V

?RDS(on) = 0.08|? @ VGS = 4.5V

?RDS(on) = 0.12|? @ VGS = 2.5V

P-Channel

?-1.6A, -20V

?RDS(on) = 0.17|? @ VGS = -4.5V

?RDS(on) = 0.25|? @ VGS = -2.5V

Fast switching speed.

Low gate charge.

High performance trench technology for extremelylow RDS(ON) .

SuperSOT? -6 package: small footprint (72% smallerthan standard SO-8); low profile (1mm thick).


FDC6327C          Applications

This product is general usage and suitable for many different applications.

 

 

 




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