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FDMA410NZ

FDMA410NZ

FDMA410NZ

ON Semiconductor

FDMA410NZ datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDMA410NZ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-VDFN Exposed Pad
Number of Pins 6
Weight 30mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2009
Series PowerTrench®
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Resistance 23MOhm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Number of Elements 1
Power Dissipation-Max 2.4W Ta
Element ConfigurationSingle
Operating ModeENHANCEMENT MODE
Power Dissipation2.4W
Case Connection DRAIN
Turn On Delay Time7.5 ns
FET Type N-Channel
Rds On (Max) @ Id, Vgs 23m Ω @ 9.5A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1080pF @ 10V
Current - Continuous Drain (Id) @ 25°C 9.5A Ta
Gate Charge (Qg) (Max) @ Vgs 14nC @ 4.5V
Rise Time3.9ns
Drive Voltage (Max Rds On,Min Rds On) 1.5V 4.5V
Vgs (Max) ±8V
Fall Time (Typ) 3.7 ns
Turn-Off Delay Time 27 ns
Continuous Drain Current (ID) 9.5A
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage 20V
Nominal Vgs 700 mV
Height 750μm
Length 2mm
Width 2mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:7887 items

Pricing & Ordering

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FDMA410NZ Product Details

Description


The FDMA410NZ is a Single N-Channel 1.5V Specified PowerTrench? MOSFET. This Single N-Channel MOSFET has been designed using an advanced Power Trench process to optimize the rDS(ON) @ VGS = 1.5 V on a special MicroFET leadframe. A form of field-effect transistor (FET) called a metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is most frequently made by carefully controlling the oxidation of silicon. It has an isolated gate, whose voltage controls the device's conductivity. Electronic signals can be switched or amplified using this material's capacity to change conductivity in response to the amount of applied voltage. Nearly all MOSFETs fall under the umbrella of a metal-insulator-semiconductor field-effect transistor, or MISFET. IGFET, or insulated-gate field-effect transistor, is another equivalent term.



Features


  • HBM ESD protection level > 2.5 kV

  • Low Profile-0.8 mm maximum in the new package MicroFET 2x2 mm

  • Free from halogenated compounds and antimony oxides

  • RoHS Compliant

  • Max rDS(on) = 23 m? at VGS = 4.5 V, ID = 9.5 A

  • Max rDS(on) = 29 m? at VGS = 2.5 V, ID = 8.0 A

  • Max rDS(on) = 36 m? at VGS = 1.8 V, ID = 4.0 A

  • Max rDS(on) = 50 m? at VGS = 1.5 V, ID = 2.0 A



Applications


  • Li-lon Battery Pack

  • Baseband Switch

  • Load Switch

  • DC-DC Conversion

  • Automotive Electronics


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