FDMA410NZ datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
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FDMA410NZ Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
6-VDFN Exposed Pad
Number of Pins
6
Weight
30mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2009
Series
PowerTrench®
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Resistance
23MOhm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
FET General Purpose Power
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Number of Elements
1
Power Dissipation-Max
2.4W Ta
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2.4W
Case Connection
DRAIN
Turn On Delay Time
7.5 ns
FET Type
N-Channel
Rds On (Max) @ Id, Vgs
23m Ω @ 9.5A, 4.5V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1080pF @ 10V
Current - Continuous Drain (Id) @ 25°C
9.5A Ta
Gate Charge (Qg) (Max) @ Vgs
14nC @ 4.5V
Rise Time
3.9ns
Drive Voltage (Max Rds On,Min Rds On)
1.5V 4.5V
Vgs (Max)
±8V
Fall Time (Typ)
3.7 ns
Turn-Off Delay Time
27 ns
Continuous Drain Current (ID)
9.5A
Gate to Source Voltage (Vgs)
8V
Drain to Source Breakdown Voltage
20V
Nominal Vgs
700 mV
Height
750μm
Length
2mm
Width
2mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
FDMA410NZ Product Details
Description
The FDMA410NZ is a Single N-Channel 1.5V Specified PowerTrench? MOSFET. This Single N-Channel MOSFET has been designed using an advanced Power Trench process to optimize the rDS(ON) @ VGS = 1.5 V on a special MicroFET leadframe. A form of field-effect transistor (FET) called a metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is most frequently made by carefully controlling the oxidation of silicon. It has an isolated gate, whose voltage controls the device's conductivity. Electronic signals can be switched or amplified using this material's capacity to change conductivity in response to the amount of applied voltage. Nearly all MOSFETs fall under the umbrella of a metal-insulator-semiconductor field-effect transistor, or MISFET. IGFET, or insulated-gate field-effect transistor, is another equivalent term.
Features
HBM ESD protection level > 2.5 kV
Low Profile-0.8 mm maximum in the new package MicroFET 2x2 mm
Free from halogenated compounds and antimony oxides