FDPC8014S datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
SOT-23
FDPC8014S Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
23 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerWDFN
Number of Pins
8
Weight
207.7333mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2017
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Subcategory
FET General Purpose Power
Max Power Dissipation
2.3W
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of Elements
2
Number of Channels
2
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
Turn On Delay Time
16 ns
Power - Max
2.1W 2.3W
FET Type
2 N-Channel (Dual) Asymmetrical
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
3.8m Ω @ 20A, 10V
Vgs(th) (Max) @ Id
2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
2375pF @ 13V
Current - Continuous Drain (Id) @ 25°C
20A 41A
Gate Charge (Qg) (Max) @ Vgs
35nC @ 10V
Rise Time
6ns
Drain to Source Voltage (Vdss)
25V
Fall Time (Typ)
4 ns
Turn-Off Delay Time
47 ns
Continuous Drain Current (ID)
41A
Gate to Source Voltage (Vgs)
12V
Drain Current-Max (Abs) (ID)
110A
Pulsed Drain Current-Max (IDM)
75A
Avalanche Energy Rating (Eas)
73 mJ
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Height
750μm
Length
5.1mm
Width
6.1mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.738099
$0.738099
10
$0.696320
$6.9632
100
$0.656906
$65.6906
500
$0.619722
$309.861
1000
$0.584644
$584.644
FDPC8014S Product Details
FDPC8014S Description
The device includes two specialized N-channel MOSFET in the dual package. The switch nodes are connected internally for easy placement and wiring of synchronous step-down converters. The control of MOSFET (Q1) and synchronous SyncFETTM devices (Q2) is designed to provide optimal power efficiency.