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FDC6301N

FDC6301N

FDC6301N

ON Semiconductor

FDC6301N datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDC6301N Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Number of Pins 6
Weight 36mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 1997
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
Termination SMD/SMT
ECCN Code EAR99
Resistance 4Ohm
Additional Feature LOGIC LEVEL COMPATIBLE
Subcategory FET General Purpose Power
Voltage - Rated DC 25V
Max Power Dissipation 900mW
Terminal Form GULL WING
Current Rating 220mA
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 900mW
Turn On Delay Time 5 ns
Power - Max 700mW
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 4 Ω @ 400mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 9.5pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 0.7nC @ 4.5V
Rise Time 4.5ns
Fall Time (Typ) 4.5 ns
Turn-Off Delay Time 4 ns
Continuous Drain Current (ID) 220mA
Threshold Voltage 850mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage 25V
Dual Supply Voltage 25V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 850 mV
Height 1mm
Length 3mm
Width 1.7mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.12524 $0.37572
6,000 $0.11765 $0.7059
15,000 $0.11006 $1.6509
30,000 $0.10095 $3.0285
75,000 $0.09715 $7.28625
FDC6301N Product Details

FDC6301N            Description


These dual N-channel logic level enhanced mode field effect transistors are produced using proprietary high cell density DMOS technology. This very high-density process is specially tailored to minimize on-resistance. This device is specially designed for low-voltage applications as a substitute for digital transistors. Because there is no need for bias resistors, these N-channel FET can replace several digital transistors with various bias resistors.


FDC6301N           Features

 

25 V, 0.22 A continuous, 0.5 A Peak

RDS(ON) = 5 |? @ VGS= 2.7 V

RDS(ON) = 4 |? @ VGS= 4.5 V

Very low level gate drive requirements allowing direct operation in 3V circuits. VGS(th) < 1.5V

Gate-Source Zener for ESD ruggedness. >6kV Human Body Model


FDC6301N            Applications

This product is general usage and suitable for many different applications.

 

 

 



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