FDZ293P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
SOT-23
FDZ293P Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
9-VFBGA
Number of Pins
9
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2006
Series
PowerTrench®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Voltage - Rated DC
-20V
Technology
MOSFET (Metal Oxide)
Current Rating
-4.6A
Number of Elements
1
Power Dissipation-Max
1.7W Ta
Element Configuration
Single
Power Dissipation
1.7W
FET Type
P-Channel
Rds On (Max) @ Id, Vgs
46m Ω @ 4.6A, 4.5V
Vgs(th) (Max) @ Id
1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
754pF @ 10V
Current - Continuous Drain (Id) @ 25°C
4.6A Ta
Gate Charge (Qg) (Max) @ Vgs
11nC @ 4.5V
Rise Time
10ns
Drain to Source Voltage (Vdss)
20V
Drive Voltage (Max Rds On,Min Rds On)
2.5V 4.5V
Vgs (Max)
±12V
Fall Time (Typ)
10 ns
Turn-Off Delay Time
22 ns
Continuous Drain Current (ID)
4.6A
Gate to Source Voltage (Vgs)
12V
Drain to Source Breakdown Voltage
-20V
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$12.277193
$12.277193
10
$11.582258
$115.82258
100
$10.926657
$1092.6657
500
$10.308168
$5154.084
1000
$9.724687
$9724.687
FDZ293P Product Details
FDZ293P Description
FDZ293P is a 2.5v P-Channel Specified PowerTrench? BGA MOSFET. Combining Fairchild's advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ293P minimizes both PCB space and RDs(ON). The BGA MOSFET FDZ293P embodies a breakthrough in packaging technology that enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low Ros(ON).
FDZ293P Features
-4.6A, -20V RDs(ON)= 46 mΩ @ VGs=-4.5V
RDs(ON)= 72mΩ @ VGs=-2.5V
Occupies only 2.25 mm2 of PCB area Less than 50% of the area of an SSOT-6
Ultra-thin package: less than 0.85 mm in height when mounted to PCB
Outstanding thermal transfer characteristics: 4 times better than SSOT-6