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FDZ293P

FDZ293P

FDZ293P

ON Semiconductor

FDZ293P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDZ293P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 9-VFBGA
Number of Pins 9
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2006
Series PowerTrench®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Rated DC -20V
Technology MOSFET (Metal Oxide)
Current Rating -4.6A
Number of Elements 1
Power Dissipation-Max 1.7W Ta
Element Configuration Single
Power Dissipation 1.7W
FET Type P-Channel
Rds On (Max) @ Id, Vgs 46m Ω @ 4.6A, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 754pF @ 10V
Current - Continuous Drain (Id) @ 25°C 4.6A Ta
Gate Charge (Qg) (Max) @ Vgs 11nC @ 4.5V
Rise Time 10ns
Drain to Source Voltage (Vdss) 20V
Drive Voltage (Max Rds On,Min Rds On) 2.5V 4.5V
Vgs (Max) ±12V
Fall Time (Typ) 10 ns
Turn-Off Delay Time 22 ns
Continuous Drain Current (ID) 4.6A
Gate to Source Voltage (Vgs) 12V
Drain to Source Breakdown Voltage -20V
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $12.277193 $12.277193
10 $11.582258 $115.82258
100 $10.926657 $1092.6657
500 $10.308168 $5154.084
1000 $9.724687 $9724.687
FDZ293P Product Details

FDZ293P Description


FDZ293P is a 2.5v P-Channel Specified PowerTrench? BGA MOSFET. Combining Fairchild's advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ293P minimizes both PCB space and RDs(ON). The BGA MOSFET FDZ293P embodies a breakthrough in packaging technology that enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low Ros(ON).



FDZ293P Features


  • -4.6A, -20V   RDs(ON)= 46 mΩ @ VGs=-4.5V

  •                     RDs(ON)= 72mΩ @ VGs=-2.5V

  • Occupies only 2.25 mm2 of PCB area Less than 50% of the area of an SSOT-6

  • Ultra-thin package: less than 0.85 mm in height when mounted to PCB

  • Outstanding thermal transfer characteristics: 4 times better than SSOT-6

  • Ultra-low Qg x RDs(ON) figure-of-merit

  • High power and current handling capability.



FDZ293P Applications


  • Battery management

  • Load switch

  • Battery protection

  • USB Type C High-end Smartphones & Tablet PCs

  • Multifunction Printers

  • Fan Motor Drives


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