STB80PF55T4 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website
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STB80PF55T4 Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Series
STripFET™ II
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
Termination
SMD/SMT
ECCN Code
EAR99
Resistance
18mOhm
Terminal Finish
Matte Tin (Sn)
Subcategory
Other Transistors
Voltage - Rated DC
-60V
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
245
Current Rating
-300mA
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
STB80P
Pin Count
4
JESD-30 Code
R-PSSO-G2
Number of Elements
1
Power Dissipation-Max
300W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
300W
Case Connection
DRAIN
Turn On Delay Time
35 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
18m Ω @ 40A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
5500pF @ 25V
Current - Continuous Drain (Id) @ 25°C
80A Tc
Gate Charge (Qg) (Max) @ Vgs
258nC @ 10V
Rise Time
190ns
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±16V
Fall Time (Typ)
80 ns
Turn-Off Delay Time
165 ns
Continuous Drain Current (ID)
40A
Threshold Voltage
3V
Gate to Source Voltage (Vgs)
16V
Drain Current-Max (Abs) (ID)
80A
Drain to Source Breakdown Voltage
-55V
Dual Supply Voltage
55V
Nominal Vgs
3 V
Height
4.6mm
Length
10.4mm
Width
9.35mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,000
$2.23146
$2.23146
STB80PF55T4 Product Details
STB80PF55T4 Description
STB80PF55T4 is a 55v P-channel STripFETTM II Power MOSFET. The Power MOSFET STB80PF55T4 is the latest development of STMicroelectronic's unique "single feature size" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics, and less critical alignment steps allowing remarkable manufacturing reproducibility.