STD150NH02LT4 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website
SOT-23
STD150NH02LT4 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Series
STripFET™ III
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Resistance
3.5mOhm
Terminal Finish
Matte Tin (Sn)
Additional Feature
LOW THRESHOLD
Subcategory
FET General Purpose Power
Voltage - Rated DC
24V
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
not_compliant
Current Rating
150A
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
STD15
Pin Count
4
JESD-30 Code
R-PSSO-G2
Qualification Status
Not Qualified
Number of Elements
1
Power Dissipation-Max
125W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
125W
Case Connection
DRAIN
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
3.5m Ω @ 75A, 10V
Vgs(th) (Max) @ Id
1.8V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
4450pF @ 15V
Current - Continuous Drain (Id) @ 25°C
150A Tc
Gate Charge (Qg) (Max) @ Vgs
93nC @ 10V
Rise Time
224ns
Drive Voltage (Max Rds On,Min Rds On)
5V 10V
Vgs (Max)
±20V
Fall Time (Typ)
40 ns
Turn-Off Delay Time
69 ns
Continuous Drain Current (ID)
150A
JEDEC-95 Code
TO-252AA
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
24V
Pulsed Drain Current-Max (IDM)
600A
Avalanche Energy Rating (Eas)
500 mJ
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
STD150NH02LT4 Product Details
STD150NH02LT4 Description
STD150NH02LT4 is an N-channel 24V STripFET? IlI Power MOSFET. The STD150NH02L utilizes the latest advanced design rules of ST?ˉs proprietary STripFET? technology. This novel 0.6|ì process utilizes also unique metallization techniques that couple with a "bondless" assembly technique resulting in an outstanding performance with a standard DPAK outline.