STS4DPF20L datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from STMicroelectronics stock available on our website
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STS4DPF20L Datasheet
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Series
STripFET™
JESD-609 Code
e4
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
80mOhm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature
LOW THRESHOLD
Subcategory
Other Transistors
Voltage - Rated DC
-20V
Max Power Dissipation
2W
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Current Rating
-4A
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
STS4D
Pin Count
8
Number of Elements
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
25 ns
Power - Max
1.6W
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
80m Ω @ 2A, 10V
Vgs(th) (Max) @ Id
2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1350pF @ 25V
Gate Charge (Qg) (Max) @ Vgs
16nC @ 5V
Rise Time
35ns
Fall Time (Typ)
35 ns
Turn-Off Delay Time
125 ns
Continuous Drain Current (ID)
4A
Threshold Voltage
1.6V
Gate to Source Voltage (Vgs)
16V
Drain Current-Max (Abs) (ID)
4A
Drain to Source Breakdown Voltage
20V
Pulsed Drain Current-Max (IDM)
16A
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Height
1.25mm
Length
5mm
Width
4mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.065360
$1.06536
10
$1.005057
$10.05057
100
$0.948167
$94.8167
500
$0.894497
$447.2485
1000
$0.843865
$843.865
STS4DPF20L Product Details
STS4DPF20L Description
This power MOSFET is the latest development of STMicroelectronics and is a unique "single feature size" strip process. The resulting transistor has extremely high packing density, low on-resistance, strong avalanche characteristics and fewer key alignment steps, so it has significant manufacturing repeatability.