Name	Value
Type	Parameter
Factory Lead Time	14 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	PowerPAK® ChipFET™ Single
Number of Pins	8
Manufacturer Package Identifier	C14-0630-ChipFET-Single
Operating Temperature	-55°C~150°C TJ
Packaging	Cut Tape (CT)
Published	2013
Series	TrenchFET®
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
ECCN Code	EAR99
Terminal Finish	Pure Matte Tin (Sn)
Subcategory	FET General Purpose Powers
Technology	MOSFET (Metal Oxide)
Peak Reflow Temperature (Cel)	260
[email protected] Reflow Temperature-Max (s)	30
Number of Channels	1
Power Dissipation-Max	3.1W Ta 31W Tc
Element Configuration	Single
Power Dissipation	3.1W
Turn On Delay Time	10 ns
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	10m Ω @ 8A, 4.5V
Vgs(th) (Max) @ Id	900mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds	1700pF @ 10V
Current - Continuous Drain (Id) @ 25°C	25A Tc
Gate Charge (Qg) (Max) @ Vgs	45nC @ 8V
Rise Time	15ns
Drive Voltage (Max Rds On,Min Rds On)	1.8V 4.5V
Vgs (Max)	±8V
Fall Time (Typ)	10 ns
Turn-Off Delay Time	30 ns
Continuous Drain Current (ID)	12.4A
Gate to Source Voltage (Vgs)	8V
Drain Current-Max (Abs) (ID)	25A
Drain to Source Breakdown Voltage	20V
Max Junction Temperature (Tj)	150°C
Height	900μm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

SI5442DU-T1-GE3

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