FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA
SOT-23
XCVU11P-3FLGA2577E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2577-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.873V~0.927V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
448
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2835000
Total RAM Bits
396150400
Number of LABs/CLBs
162000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU11P-3FLGA2577E Product Details
XCVU11P-3FLGA2577E Overview
There is a 2577-BBGA, FCBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. There are 448 I/Os for better data transfer. A fundamental building block consists of 2835000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to operate it, it requires a voltage supply of 0.873V~0.927V . The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 396150400. This FPGA is built as an array of 162000 LABs/CLBs.
XCVU11P-3FLGA2577E Features
448 I/Os Up to 396150400 RAM bits
XCVU11P-3FLGA2577E Applications
There are a lot of Xilinx Inc. XCVU11P-3FLGA2577E FPGAs applications.