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XCVU11P-3FLGA2577E

XCVU11P-3FLGA2577E

XCVU11P-3FLGA2577E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA

SOT-23

XCVU11P-3FLGA2577E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 2577-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Virtex® UltraScale+™
Part Status Active
HTS Code 8542.39.00.01
Voltage - Supply 0.873V~0.927V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 448
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2835000
Total RAM Bits 396150400
Number of LABs/CLBs 162000
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU11P-3FLGA2577E Product Details

XCVU11P-3FLGA2577E Overview


There is a 2577-BBGA, FCBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. There are 448 I/Os for better data transfer. A fundamental building block consists of 2835000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to operate it, it requires a voltage supply of 0.873V~0.927V . The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 396150400. This FPGA is built as an array of 162000 LABs/CLBs.

XCVU11P-3FLGA2577E Features


448 I/Os
Up to 396150400 RAM bits

XCVU11P-3FLGA2577E Applications


There are a lot of Xilinx Inc. XCVU11P-3FLGA2577E FPGAs applications.

  • ADAS
  • Artificial intelligence (AI)
  • Military Temperature
  • Wired Communications
  • Telecommunication
  • Scientific Instruments
  • Space Applications
  • OpenCL
  • Aerospace and Defense
  • Industrial,Medical and Scientific Instruments

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