XCVU33P-3FSVH2104E Overview

There is a 2104-BBGA, FCBGA package that includes this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 208 I/Os are available for transferring data more efficiently. Logic blocks consist of 961800 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates at a voltage of 0.873V~0.927V and uses a battery to supply power. It is a type of FPGA belonging to the Virtex? UltraScale+? seies. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. Having a RAM bit size of 24746394 means that this device will offer you a lot of memory. An array of 54960 LABs/CLBs is built into the FPGA.

XCVU33P-3FSVH2104E Features

208 I/Os
Up to 24746394 RAM bits

XCVU33P-3FSVH2104E Applications

There are a lot of Xilinx Inc. XCVU33P-3FSVH2104E FPGAs applications.

• Artificial intelligence (AI)
• Bioinformatics
• Industrial Ethernet
• Medical Applications
• Solar Energy
• Wireless Communications
• Camera time adjustments
• Space Applications
• Medical imaging
• Military Temperature