IRF7105TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF7105TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2003
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
100mOhm
Terminal Finish
Matte Tin (Sn)
Additional Feature
ULTRA LOW RESISTANCE
Max Power Dissipation
2W
Terminal Position
DUAL
Terminal Form
GULL WING
Current Rating
3.5A
Base Part Number
IRF7105PBF
Number of Elements
2
Number of Channels
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
7 ns
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
100m Ω @ 1A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
330pF @ 15V
Current - Continuous Drain (Id) @ 25°C
3.5A 2.3A
Gate Charge (Qg) (Max) @ Vgs
27nC @ 10V
Rise Time
13ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
37 ns
Turn-Off Delay Time
45 ns
Continuous Drain Current (ID)
3.5A
Threshold Voltage
1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
25V
Pulsed Drain Current-Max (IDM)
14A
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Standard
Nominal Vgs
3 V
Height
1.75mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.332856
$0.332856
10
$0.314015
$3.14015
100
$0.296240
$29.624
500
$0.279472
$139.736
1000
$0.263653
$263.653
IRF7105TRPBF Product Details
IRF7105TRPBF Description
The fifth generation HEXFET from the international rectifier uses advanced processing technology to achieve the lowest possible on-resistance per silicon area. Combined with fast switching speed and rugged device characteristics, HEXFETPower MOSFET is well known, providing designers with an extremely efficient device for use in a variety of applications.SO-8 is improved by customizing lead frames to enhance thermal and multi-chip capabilities, making it an ideal choice for a variety of power applications. Through these improvements, multiple devices can be used in applications that significantly reduce circuit board space. The package is designed for vapor phase infrared or wave soldering technology. In typical PCB placement applications, it is possible to consume more than 0.8W.
IRF7105TRPBF Features
Advanced Process Technology
Ultra Low On-Resistance
Dual N and P Channel Mosfet
Surface Mount
Available in Tape &Reel
Dynamic dv/dt Rating
Fast Switching
Lead-Free
IRF7105TRPBF Applications
providing designers with an extremely efficient device for use in a variety of applications.